Address thermal challenges in electronics with these materials
The TC-5622 and TC-5351 Thermally Conductive Compounds are designed for electronics applications in many markets including transportation, semiconductors, power electronics, solid-state lighting, data centers, telecommunications and consumer electronics. Using these compounds can aid in maintaining the long-term performance and reliability of equipment. Boasting low specific gravity and high bulk thermal conductivity, TC-5622 offers high-quality thermal performance and improved stability against hardening or dry-out in end-use applications. TC-5622 also exhibits low thermal resistance in both thin and thicker bond line thickness (BLT) applications that demand high heat dissipation. Formulated with high viscosity, TC-5351 is well suited for applications demanding resistance to high temperatures and large gap thicknesses as well as vertical applications requiring a thermal material able to remove heat without flowing out of the gap or changing viscosity as temperatures rise. — Dow Corning, Midland, Mich.