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Comment PDF Business & Economics

Nicholas Chopey scholarship awarded

By Chemical Engineering |

1The 2015 Nicholas P. Chopey Scholarship for Chemical Engineering Excellence has been awarded to Stephanie Kong, a student at the University of Buffalo (www.buffalo.edu), who is majoring in both chemical engineering and Spanish.

Kong is a member of Tau Beta Pi (National Engineering Honor Society) and Phi Beta Kappa, and is on the Engineering Dean’s List. This year, she was selected as a Goldwater Scholar for her research in model surfactant systems that can be used to create eco-friendly dispersants for oil spills. Kong has also worked for Praxair’s Research and Development Division. She plans to complete her double degree in May 2016 and then begin her studies toward a Ph.D. degree in chemical engineering the following fall.

 

About the scholarship

Chemical Engineering has sought to bring recognition to the chemical engineering profession and to continually advance that profession, since the magazine’s founding in 1902. To help advance those goals, CE established the annual Chopey Scholarship for Chemical Engineering Excellence in late 2007. The award is named after Nicholas P. Chopey, the magazine’s former Editor-in-Chief, whose valuable contributions to CE over the 47 years that he devoted to it are long-lasting. To honor his contributions to the chemical engineering profession, CE established the scholarship in his name.

Applicant qualifications.The scholarship is awarded to current third-year students who are enrolled in a fulltime undergraduate course of study in chemical engineering at one of the following four-year colleges or universities, which include Mr. Chopey’s alma mater and those of our editorial staff:

  • University of Buffalo
  • University of Kansas
  • Columbia University
  • University of Virginia
  • Rutgers University
  • University of Oklahoma

The scholarship is a one-time award. The program utilizes standard Scholarship America recipient selection procedures, including the consideration of past academic performance and future potential, leadership and participation in school and community activities, work experience, and statement of career and educational goals.

More information about the award, including how to apply and how to contribute a donation, can be found at www.chemengonline.com/npcscholarship

 

Postscripts, corrections

June, 2015, “High-Performance Internals Boost Tower Capacities”, p. 24 and p. 27. In the article and in the photo caption for Figure 1, NeXRing is incorrectly referred to as a structured packing — it should be described as a random packing. The corrected version of the full article can be found at www.chemengonline.com.

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