LG Chem Ltd. (Seoul, South Korea) announced that it has completed the development of a liquid photo-imageable dielectric (PID), a key material for advanced semiconductor packaging, and is now gearing up to actively address the demand in AI and other high-performance semiconductor markets.
PID is a photosensitive dielectric material used to form ultra-fine interconnects between semiconductor chips and substrates. By creating pathways for electrical signals and improving circuit fidelity, PID enhances device performance and reliability in advanced packaging processes.
The importance of PID continues to grow as high-performance semiconductors require denser and more precise circuitry. LG Chem’s liquid PID offers high-resolution patterning, low-temperature curing capability, and features low shrinkage and low moisture absorption properties, improving process stability. Furthermore, it is free of per- and polyfluoroalkyl substances (PFAS) and excludes organic solvents such as N-methyl-2-pyrrolidone (NMP) and toluene, ensuring compliance with increasingly stringent environmental regulations.
Accelerating Development of Film-Type PID for Advanced IC Substrates
To compete in a market historically led by Japanese materials makers, LG Chem has leveraged its expertise in film technologies – spanning across displays, semiconductors, and automotive electronics – to complete the development of film-type PID and is now advancing joint programs with top global semiconductor companies.
With the rapid drive toward higher performance, both chips and IC substrates now require larger formats and finer features. As substrates scale up, differences in thermal expansion and contraction increase the risks of cracking, while conventional liquid PIDs have struggled to ensure double-sided application and uniform coating on large panels.
LG Chem’s film PID is supplied as an attachable film that maintains uniform thickness and pattern fidelity even on large substrates. Its high strength and elasticity, combined with low moisture absorption, help minimize cracking under repeated thermal cycling. Additionally, substrate manufacturers can utilize their existing lamination equipment without requiring any process changes, enabling seamless adoption.
LG Chem CEO Shin Hak-cheol stated: “LG Chem is proactively addressing our customers’ needs for advanced packaging innovation across a broad materials portfolio. We are committed to going beyond simple material supply to shape new industry trends with our customers.”
LG Chem is strengthening its position in advanced semiconductor packaging by mass-producing and developing key back-end materials, including Copper-Clad Laminate (CCL), Die Attach Flim (DAF), Non-Conductive Film (NCF), and Build-Up Film (BUF).