Mitsubishi Chemical Corp. (Tokyo, Japan) has announced plans to commercialize ultra-high-purity colloidal silica for use as a raw material for polishing agents in cutting-edge semiconductors. The company plans to establish new production facilities at its Kyushu Plant (Fukuoka Area) in Kitakyushu City, Fukuoka Prefecture, and begin commercial operations in October 2028.
Colloidal silica is used as a raw material for surface polishing agents for silicon wafers and as a raw material for chemical mechanical polishing (CMP) slurries used on the interconnect layers of silicon wafers. When polishing the wiring layers of silicon wafers, it is necessary to achieve high material removal rates while simultaneously flattening the surface at the nanoscale, ensuring the absence of impurities, and minimizing scratches; the appropriate shape and physical properties of colloidal silica particles vary depending on the material being polished.
The ultra-high-purity colloidal silica that Mitsubishi Chemical Corp. (Tokyo, Japan) is commercializing is produced through an integrated manufacturing process using an ultra-high-purity raw material — tetramethoxysilane — that minimizes impurity content. Drawing on advanced technical expertise cultivated over many years, parameters such as particle size and density can be customized to meet customers’ needs.