Source: DAS Environmental Experts
ALCEA is a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space. ALCEA is based on a proven plasma-enhanced Catalytic Technology. Reactive oxygen species are formed (ROS), which drive reactions on the catalyst surface. The process converts NOx into more highly oxidized, water-soluble nitrogen compounds that can subsequently be removed in a downstream central wet abatement system. The dry-oxidation process requires no injection of special gases and the catalysts are reusable. Depending on NOx concentration, prior treatment and plasma power, ALCEA handles volume flows of up to 5,000 standard liters per minute and achieves NOx reduction of up to 95%. Specified power consumption is up to 3.2 kW, depending on the NOx concentration. The system supports up to two catalyst ducts for dual systems or two individual local scrubbers. Process cooling water, reusable catalysts and a design geared toward low maintenance requirements and downtime support integration into ongoing fab operations. Developed in one of the world’s leading semiconductor ecosystems, ALCEA was created in collaboration with Industrial Technology Research Institute (ITRI), Taiwan’s premier applied technology research institute. — DAS Environmental Experts GmbH, Dresden, Germany