Sumitomo Bakelite Co. (Tokyo) announced plans to acquire all shares of a company newly established by Kyocera Corp., and thereafter will succeed part of the Chemical Business from Kyocera by an absorption-type company split. By acquiring shares of the New Company that will succeed part of Kyocera’s Chemical Business, specifically regarding epoxy-resin molding compounds for encapsulation of semiconductor devices, bonding pastes for semiconductor devices and resins for industrial use, Sumitomo Bakelite intends to further enhance the presence in the ICT domain and accelerate the strengthening of technological capabilities to create high value-added products.
By integrating the New Company’s proprietary technologies with Sumitomo Bakelite’s high technological capabilities that meet customer needs in areas such as epoxy resin molding compounds for encapsulation of semiconductor devices and bonding pastes for semiconductor devices, the Company will increase the standing in the expanding market for AI data center applications and so on. Sumitomo Bakelite also acquired the polycarbonates business from AGC in 2025.
The expected effective date for the company split and share transfer is October 2026.