Sumitomo Bakelite Co., Ltd. (Shinagawa-ku, Tokyo, Japan) will expand production capacity for encapsulation materials used in advanced semiconductor packages at its sites in Suzhou, China, and Singapore. New production lines will be installed at both sites for SUMIKON™ EME molded underfill (MUF) materials and compression-molding granules.
Demand for advanced semiconductors used in applications such as generative AI and communications satellites is growing rapidly, particularly in China and Southeast Asia. At the same time, semiconductor packages are becoming increasingly dense, thin, and large.
Sumitomo Bakelite’s MUF materials provide excellent filling performance in microscopic gaps and low-warpage characteristics. By filling solder joints and encapsulating the entire package in a single molding process, they deliver both high reliability and manufacturing efficiency.
The company’s compression-molding granules also provide excellent filling performance in narrow gaps. By optimally controlling filler size, resin viscosity, and particle-size distribution, they enable uniform molding and low warpage even for large panels, thereby improving productivity in advanced semiconductor manufacturing. To leverage the strengths of these products and technologies and respond promptly and reliably to growing demand, Sumitomo Bakelite will expand production capacity in Suzhou, China, and Singapore.