Mobile Navigation

Chemical Engineering

View Comments

This new resin for heat-resistant molded parts is solvent-free

| By Mary Bailey

Source: Wacker

POWERSIL Resin 710 is designed for for heat-resistant molded parts that can withstand temperatures above 200°C over long periods. WACKER offers a material solution for  Using the silicone resin compound, molded parts can be produced by compression molding, pressure gelation, or even injection molding. The material is suitable for thermal class R components, which are able to withstand temperatures of up to 220°C for extended periods of time. The new product is an alternative to high-temperature-resistant polymers such as PTFE (polytetrafluoroethylene) and PEEK (polyetheretherketone). Components manufactured using the new product are characterized by good electrical insulation properties, mechanical strength and UV stability. POWERSIL Resin 710 is solvent-free and not subject to labeling requirements. It comes with a low viscosity, which facilitates processing. The material is available either as a peroxide-curing version for the production of heat-resistant, ready-to-use parts or as a variant that cures with small quantities of a standard silicone catalyst. — Wacker Chemie AG, Munich, Germany

www.wacker.com