Source: Henkel
Technomelt PA 6370 is a highly flowable, ultra-low melt viscosity low-pressure molding material engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling gaps as small as 0.5mm, the new polyamide-based hot melt meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability. Technomelt materials offer fast, gentle, low-energy processing capabilities and lower standard emissions compared to conventional potting encapsulants. Some potting materials may require as many as eight steps and up to 24 h to process. In comparison, Technomelt hot melts encapsulate electronic parts in three simple steps with minimal pressure and cycle times as low as 30 seconds. Until now, achieving small dimension filling while maintaining the proven protective characteristics of Technomelt materials has been challenging. Technomelt PA 6370 has resolved this with an ultra-low melt viscosity (2700 – 3000 mPa·s @ 210° C; 1065-1180 mPa·s at 240° C) that delivers good penetration and wetting along with high adhesion stability on multiple substrates, passing lap shear testing after 1,200 hours exposure to high heat and moisture (85°C/85° RH). Technomelt PA 6370 has excellent electrical insulation properties and meets the UL 94 V-0 flame retardancy standard. The material’s low coefficient of thermal expansion (CTE) of 175 ppm is also notable, rivaling that of many two-part polyurethane and epoxy potting formulas. This characteristic confirms Technomelt PA 6370’s dimensional stability and stress-resistance across its wide operating temperature range of -20° C to 140° C. Technomelt PA 6370 is well-suited for low-voltage applications such as motors, as well as connectors, sensors, printed circuit boards, and any electronic device operating in harsh, demanding conditions.— Henkel AG, Düsseldorf, Germany