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BASF extends joint R&D program with IMEC

By Gerald Ondrey |

BASF SE (Ludwigshafen, Germany; www.basf.com) and IMEC (Leuven, Belgium; www2.imec.be), Europe’s leading independent nanoelectronics research center, have announced today that they are extending their joint development program. The process chemicals which the two partners plan to develop as part of their extended work together will enhance the performance of cleaning chemicals in the production of semiconductors. Research will also focus on reduction of process complexity and the number of production steps. The next phase of the joint development will be focusing on selective cleaning solutions to enable new generation of chips based on 22-nm technology. These solutions are used in the front-end-of-line (FEOL), which the first part of IC (integrated circuit) production where the individual devices (for example transistors) are patterned in the semiconductor. It is important that the cleaning solutions do not affect the metals that are used, especially in the new transistors which feature a vast number of different metal components. The first products for the FEOL will be available in 2011. BASF already joined IMEC’s affiliation program to develop innovative cleaning solutions for the semiconductor industry in…
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PTA production: Lowering OPEX without compromising on quality

A paper that looks at how the earlier PTA production method involving a multi-stage process with pressure and atmospheric centrifuges and a re-slurry tank can be replaced with one stand-alone device – the rotary pressure filter (RPF).

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