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Chemical Engineering

Fujifilm to expand CMP slurry production in Arizona with $18-million investment

| By Mary Bailey

FUJIFILM Corp. (Tokyo) will expand its semiconductor materials business by enhancing production facilities for copper interconnect CMP (chemical mechanical planarization) slurries at the FUJIFILM Electronic Materials U.S.A., Inc. (North Kingstown, R.I.) production site in Mesa, Ariz. Fujifilm will also establish new production facilities capable of multiproduct manufacturing of CMP slurries for diversified semiconductor manufacturing processes, including advanced packaging applications.

The investment, totaling $18 million (approximately ¥3 billion), addresses increasing demand for copper interconnect CMP slurries, and supports long-term growth in advanced logic, advanced memory and advanced packaging applications.

“The advanced semiconductor market has entered a period of significant growth, driven by the rapid expansion of demand related to artificial intelligence,” says Brian O’Donnelly, president and CEO of FUJIFILM Electronic Materials U.S.A. and corporate vice president of Fujifilm. “As global semiconductor demand continues to increase, demand for CMP slurries—an essential material used in advanced semiconductor manufacturing—is also growing.”

In particular, demand for CMP slurry for copper interconnects, a product for which Fujifilm has a leading global market share, is increasing in the advanced logic and memory sectors.

In the U.S., major semiconductor manufacturers continue to invest in new and expanded production facilities, resulting in high demand for semiconductor materials. In response to these market conditions, FUJIFILM Electronic Materials U.S.A. will expand its CMP slurry production in Mesa, Ariz. In addition to expanding capacity for copper interconnect CMP slurries used in BEOL (Back End of Line) processes, Fujifilm will establish new production facilities capable of manufacturing a wide range of CMP slurry products for FEOL (Front End of Line), Middle of Line and advanced packaging applications, including hybrid bonding. The new production facilities will serve as a bridge between product development and commercial manufacturing, enabling technologies developed at the Arizona site’s global CMP slurry R&D center to be transferred quickly into mass production.

The expanded production line is scheduled to begin operations in 2027. Once operational, CMP slurry production capacity at Fujifilm’s Mesa facility will further support medium- and long-term growth in demand.

Going forward, Fujifilm will continue to provide a broad portfolio covering nearly all semiconductor manufacturing processes, from leading-edge to legacy nodes, leveraging its global manufacturing network across Japan, the U.S., Europe and Asia.